Interflux solder IF-14 Sn60/Pb40
Symbol Micros:
CH CD.150-.50
Case : Rys.CH CD.50
Composition: Sn60%, Pb40%, flux: 1.4%, diameter 1,50mm, weight 500g. Melting temperature: 183 - 191°C
Parameters
| Diameter: | 1,50mm |
| Melting point: | 183°C~191°C |
| Alloy composition: | Sn60Pb40 |
| Mass: | 500g |
| Manufacturer: | Interflux |
| Diameter: | 1,50mm |
| Melting point: | 183°C~191°C |
| Alloy composition: | Sn60Pb40 |
| Mass: | 500g |
| Manufacturer: | Interflux |
Detailed description
The Interflux® IF 14 series is a halogen-free, completely free from halides, uncleaned solder wires with easily removable residues in SnPb (Ag) and lead-free alloys.
Residues can be washed by hand.
Composition: Sn 60%, Pb 40%,
Flux: 1.4%,
Diameter: 1.5mm,
Weight: 500g.
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