Sn99,3Cu0,7  0,70mm 500g

Solder Alloy S-Sn99Cu 0.7

The Solder Alloy S-Sn99Cu 0.7 is a high-quality solder wire produced by Cynel Unipress, designed for professional electronic assembly in compliance with ecological standards. This product provides a reliable foundation for electronic projects, offering excellent alloy purity and high precision, which is crucial in lead-free technology.

Key Features and Specifications of Solder Alloy S-Sn99Cu 0.7

Choosing the right solder alloy determines the mechanical durability and electrical conductivity of solder joints. The high quality and optimized chemical composition of this solder are ensured by the following parameters:

• Alloy composition: Tin (Sn) 99.3% and Copper (Cu) 0.7%.
• Melting temperature: Approximately 227°C, requiring professional soldering stations with adequate power.
• Type of flux: Contains F-SW21 flux (1.1.3 according to DIN EN 29454-1), "no-clean" type, which does not require cleaning after soldering.
• Wire diameter: Precise 0.70 mm, ideal for dense surface-mount (SMD) and through-hole (THT) assembly.
• Flux content: Optimal 2.2% of solder mass, enabling fast and clean joint formation.
• Weight and packaging: 50 g spool, protecting the wire from mechanical damage and tangling.

Our solder wire provides a solid foundation for many modern applications compliant with the RoHS directive.

Typical Applications of S-Sn99Cu 0.7

Thanks to the complete elimination of lead, this solder wire is environmentally safe and meets the strict requirements of the industrial sector. It is most commonly used for:

• Industrial assembly of printed circuit boards (PCBs) on professional production lines;
• Servicing and repair of consumer electronics, such as laptops, smartphones, and audio systems;
• Prototyping and research circuits in electronics laboratories;
• Construction of industrial automation control systems and measuring instruments;
• Applications in the automotive industry, where joint resistance to vibration and temperature variations is required.

Thanks to its proven formula and stable physicochemical properties, this solder is used in almost every modern electronics manufacturing facility.

Solder composition: Sn 99%, Cu 1%.
Spool: diameter 0.70mm
Weight: 500g.
Melting temperature: 230°C to 240°C