CH Kl-term.10
Symbol Micros:
CH Kl-term.10
Case : Rys.CH Kl-term.10
Heat conductive AG Termo Glue; 10g; For mounting heat sinks on components such as the memory chips, transistors or bridge rectifiers; Work temperature up to 200°C;
Parameters
| Name: | AG TermoGlue |
| Product type C: | Thermally conductive adhesive |
| Capacity [g]: | 10g |
| Capacity [ml]: | 0ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
| Name: | AG TermoGlue |
| Product type C: | Thermally conductive adhesive |
| Capacity [g]: | 10g |
| Capacity [ml]: | 0ml |
| Manufacturer: | AG Termopasty |
| Type of packaging: | Syringe |
| Type: | Paste |
Detailed description
Thermal Conductive Adhesive AG Termo Glue 10g
AG TermoGlue Thermal Conductive Adhesive is an excellent solution for attaching heat sinks, such as on memory chips, transistors, or bridges. The resulting connection is super-durable and provides excellent heat conductivity.
Properties:
-
Color: white
Surface drying time [25°C, h]: 30
Hardness: 45 - 75
Tensile strength (MPa): 2.0
Elongation (%): 100
Thermal conductivity (W/mK): > 1.0
Resistance (c-in/W): < 2.0 x 1015
Dielectric strength (KV/mm): 20
Dielectric constant: 3.0
Dielectric loss factor (60Hz): 0.003
Dielectric constant: > 5.1
Operating temperature (max): 200°C
Application:
- Ideal for use with processors, chipsets, GPUs, and other components.
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