CH Kl-term.120
Symbol Micros:
CH Kl-term.120
Case : Rys.CH Kl-term.120
Heat conductive AG Termo Glue; 120g; For mounting heat sinks on components such as the memory chips, transistors or bridge rectifiers; Work temperature up to 200°C;
Parameters
| Name: | AG TermoGlue |
| Product type C: | Thermally conductive adhesive |
| Capacity [g]: | 120g |
| Capacity [ml]: | 0ml |
| Type of packaging: | Tube |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Name: | AG TermoGlue |
| Product type C: | Thermally conductive adhesive |
| Capacity [g]: | 120g |
| Capacity [ml]: | 0ml |
| Type of packaging: | Tube |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
Detailed description
Thermal Conductive Adhesive AG TERMOGlUE 120g
- AG TermoGlue Thermal Conductive Adhesive is an excellent solution for attaching heat sinks, such as on memory chips, transistors, or bridges. The resulting connection is super-durable and provides excellent heat conductivity.
Properties:
-
Color: white
Surface drying time [25°C, h]: 30
Hardness: 45 - 75
Tensile strength (MPa): 2.0
Elongation (%): 100
Thermal conductivity (W/mK): > 1.0
Resistance (c-in/W): < 2.0 x 1015
Dielectric strength (KV/mm): 20
Dielectric constant: 3.0
Dielectric loss factor (60Hz): 0.003
Dielectric constant: > 5.1
Operating temperature (max): 200°C
Application:
Used to attach a heat sink to memory chips, resistors, and bridges.
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