CH PaL100
Symbol Micros:
CH PaL100
Case : Rys.CH PaL100
Soldering paste 100g, flux for easy soldering used mainly where rosin is not enough
Parameters
| Product type C: | Solder paste |
| Capacity [g]: | 100g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Can |
| Product type C: | Solder paste |
| Capacity [g]: | 100g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Can |
Detailed description
AG TermoPasty Soldering Paste 100g
Soldering paste according to DIN EN 29454-1 1.1.2.C is a medium-active flux with a paste-like consistency made from rosin and a halogenated organic activator, which facilitates the soldering of copper, silver-plated, zinc-coated, and nickel-plated elements. It is used for tinning and soldering in radio and telecommunications techniques, as well as during the assembly of electrical devices. Residues of the flux after soldering do not cause corrosion on non-ferrous metals and can remain on the solder joints. (Recommended to be cleaned with Alcohol Cleaner).
This product is mainly used where rosin alone is not sufficient.
Application:
- soldering of elements: copper
- silver-plated
- zinc-coated and nickel-plated
- tinning and soldering in radio and telecommunications techniques
- during the assembly of electrical devices
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