CH PaLEP-008cu

Symbol Micros: CH PaLEP-008cu

57659

CH PaLEP-008cu

Contractor Symbol:

Case : Rys.CH PaLEP-008cu

Datasheet

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Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical

Parameters

Capacity [ml]:	1,4ml
Product type C:	Solder paste
Capacity [g]:	8g
Type:	Paste
Type of packaging:	Syringe
Manufacturer:	AG Termopasty

All parameters

Manufacturer:: AG TERMOPASTY Manufacturer part number: Easy Print Sn96,5Ag3Cu0.5 6g ART.AGT-028 Case style: Rys.CH PaLEP-008cu Datasheet

In stock:

0 pcs.

Quantity of pcs.	1+	5+	20+	50+	200+
Net price (EUR)	4,2358	3,6421	3,4106	3,3288	3,2587

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Packaging:
5 Quantity (multiple: 1)

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Item in delivery

Estimated date:
2025-05-09

Quantity of pcs.: 10

• Parameters

Capacity [ml]:	1,4ml
Product type C:	Solder paste
Capacity [g]:	8g
Type:	Paste
Type of packaging:	Syringe
Manufacturer:	AG Termopasty

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