CH PaLEP-008cu

Symbol Micros: CH PaLEP-008cu
Contractor Symbol:
Case : Rys.CH PaLEP-008cu
Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical
Parameters
Capacity [ml]: 1,4ml
Product type C: Solder paste
Capacity [g]: 8g
Type of packaging: Syringe
Manufacturer: AG Termopasty
Type: Paste
         
 
Item available on request
Capacity [ml]: 1,4ml
Product type C: Solder paste
Capacity [g]: 8g
Type of packaging: Syringe
Manufacturer: AG Termopasty
Type: Paste