CH PaLEP-008cu
Symbol Micros:
CH PaLEP-008cu
Case : Rys.CH PaLEP-008cu
Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical
Parameters
| Capacity [ml]: | 1,4ml |
| Product type C: | Solder paste |
| Capacity [g]: | 8g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Syringe |
| Capacity [ml]: | 1,4ml |
| Product type C: | Solder paste |
| Capacity [g]: | 8g |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Type of packaging: | Syringe |
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