CH PaLEP-250cu

Symbol Micros: CH PaLEP-250cu
Contractor Symbol:
Case : Rys.CH PaLEP-250cu
Solder paste for SMD komponents in the process does not include washing phase contains a rosin-based flux, very good mechanical properties and electrical
Parameters
Product type C: Solder paste
Capacity [g]: 250g
Manufacturer: AG Termopasty
Type: Paste
Type of packaging: Plastic container
         
 
Item available on request
Product type C: Solder paste
Capacity [g]: 250g
Manufacturer: AG Termopasty
Type: Paste
Type of packaging: Plastic container