The copper-based thermal paste is designed for filling the processor to radiator connections in order to improve cooling. Thermal conductivity ~ 3.1 W/mK.
Applications:
Filling processor to radiator connections
Not suitable for aluminum radiators
Does not conduct electricity
The provided name is already taken
The symbol contains forbidden characters or is too short. The symbol can consist of upper and lower case letters, spaces, special characters: "-", "/", "." and must have at least 3 characters.
Subscribe to the newsletter
Receive news about promotions, discount coupons and news in our shop.
Contact us Working hours:
Mon-Fri 8:00 a.m. - 4:00 p.m. (UTC/GMT +2 hours)
