CH PaTermCu1.5
Symbol Micros:
CH PaTermCu1.5
Case : Rys.PATERMCU1.5
Heat conductive paste based on copper; 1.5cm3; Thermal conductivity ~3.1W/m2; For filling the connections processor - radiator to improve cooling;
Parameters
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 0mg |
| Capacity [ml]: | 1,5ml |
| Type of packaging: | Syringe |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
| Name: | Copper Thermal Grease |
| Product type C: | Thermal paste |
| Capacity [g]: | 0mg |
| Capacity [ml]: | 1,5ml |
| Type of packaging: | Syringe |
| Manufacturer: | AG Termopasty |
| Type: | Paste |
Detailed description
Copper-based Thermal Grease, 1.5cm³
The copper-based thermal paste is designed for filling the processor to radiator connections in order to improve cooling. Thermal conductivity ~ 3.1 W/mK.
Applications:
- Filling processor to radiator connections
- Not suitable for aluminum radiators
- Does not conduct electricity
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