Special purpose (results: 49)
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Capacity [ml]
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Product type C
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51657 30g Qoltec
Thermal grease, 5.15W/m-K, 1g, grey, max 0.004°C/W
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In stock:
0 pcs. |
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Packaging: 4 Quantity (multiple 1) |
1g | Qoltec | Thermal paste | Paste | Syringe | ||||||||||||||
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51633 30g Qoltec
Thermal grease, 1.42W/m-K, 30g, white, max 0.249°C/W
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In stock:
5 pcs. |
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Packaging: 5 Quantity (multiple 1) |
30g | Qoltec | Thermal paste | Paste | Syringe | ||||||||||||||
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51634 100g Qoltec
Thermal grease, 1.42W/m-K, 100g, white, max 0.249°C/W
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In stock:
6 pcs. |
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Packaging: 6 Quantity (multiple 1) |
100g | Qoltec | Thermal paste | Paste | Tube | ||||||||||||||
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51638 30g Qoltec
Thermal grease, 1.93W/m-K, 30g, grey, max 0.225°C/W
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In stock:
8 pcs. |
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Packaging: 5 Quantity (multiple 1) |
30g | Qoltec | Thermal paste | Paste | Syringe | ||||||||||||||
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ART.AGT-223 AG Termopasty
Two-component epoxy filling compound 141; 100g; Resin; Syringe;
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In stock:
23 pcs. |
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Packaging: 4 Quantity (multiple 1) |
100g | AG Termopasty | Zalewa epoksydowa 141 | Epoxy filling compound | Resin | Syringe | |||||||||||||
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51655 1g Qoltec
Thermal grease, 5.15W/m-K, 1g, grey, max 0.004°C/W
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In stock:
5 pcs. |
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Packaging: 10 Quantity (multiple 1) |
1g | Qoltec | Thermal paste | Paste | Syringe | ||||||||||||||
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ART.AGT-122 AG Termopasty
Sodium persulfate for etching copper and PCB circuits etching, Fine-Crystaline; 1kg; Bottle;
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In stock:
1 pcs. |
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Packaging: 1 Quantity (multiple 1) |
1kg | 0ml | AG Termopasty | Sodium Persulfate | Copper etching | Liquid | Bottle | ||||||||||||
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In stock:
4 pcs. |
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Packaging: 4 Quantity (multiple 1) |
1kg | 0ml | AG Termopasty | Sodium Persulfate | Copper etching | Liquid | Bottle | ||||||||||||
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CH PaSH007
Thermo conductive silicone paste H; Metal tube; 7g; -50°C ~ 200°C; Improves the flow of heat between electronic component and heatsink;
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In stock:
463 pcs. |
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Packaging: 10 Quantity (multiple 1) |
7g | 0ml | AG Termopasty | Silicone paste H | Thermal paste | Paste | Tube | ||||||||||||
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CH PaSN025s
Thermo conductive silicone paste H; Syringe; 25g; -50°C ~ 200°C; Improves the flow of heat between electronic component and heatsink;
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In stock:
124 pcs. |
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Packaging: 8 Quantity (multiple 1) |
25g | 0ml | AG Termopasty | Silicone paste H | Thermal paste | Paste | Syringe | ||||||||||||
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ART.AGT-057 AG TERMOPASTY Thermo conductive silicone paste H
Thermo conductive silicone paste H; Plastic container; 100g; -50°C ~ 200°C; Improves the flow of heat between electronic component and heatsink;
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In stock:
212 pcs. |
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Packaging: 8 Quantity (multiple 1) |
100g | 0ml | AG Termopasty | Silicone paste H | Thermal paste | Paste | Plastic container | ||||||||||||
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CH Zam600
Freeze; -55°C; 600ml; Spray; Chemically pure, non-toxic and inert to most materials;
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In stock:
66 pcs. |
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Packaging: 12 Quantity (multiple 1) |
0mg | 600ml | AG Termopasty | Freezer | Freeze spray | Aerosol | Can | ||||||||||||
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ART.123 FREEZE 55
Non-toxic cooling agent for troubleshooting by thermal way; 400ml; Combustible; Immediately decreases temperature to -55°C;
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In stock:
22 pcs. |
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Packaging: 12 Quantity (multiple 1) |
0mg | 400ml | Micro Chip Elektronic | Freeze 55 | Freeze spray | Aerosol | Can | ||||||||||||
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ART.124 FREEZE 55
FREEZE 55; Combustible; Immediately decreases temperature to -55°C; 600ml; Clean, non-toxic cooling agent for troubleshooting by thermal way;
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In stock:
40 pcs. |
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Packaging: 12 Quantity (multiple 1) |
0mg | 600ml | Micro Chip Elektronic | Freeze 55 | Freeze spray | Aerosol | Can | ||||||||||||
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TRANSPARENT 21 Kontakt Chemie
Transparent spray; 200ml; Colourless; Density at 20°C: 0.79g/cm3; Drying time: 20min. (20°C);
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Manufacturer:
CRC Industries Manufacturer part number: TRANSPARENT 21 RoHS Case style: RysCH TRANS-21.200 |
In stock:
1 pcs. |
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Stock availableWhile the stock lasts
Packaging: 12 Quantity (multiple 1) |
0mg | 200ml | KONTAKT CHEMIE | Transparent 21 | Makes paper transparent | Aerosol | Can | ||||||||||||
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POSITIV 20 Kontakt Chemie
Photosensitive lacquer for PCB; 200ml; Blue; Density at 20°C: 0.87g/cm3; Drying time: 17min. (70°C);
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In stock:
8 pcs. |
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Packaging: 12 Quantity (multiple 1) |
0mg | 200ml | KONTAKT CHEMIE | Positiv 20 | Photosensitive varnish | Aerosol | Can | ||||||||||||
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GRAPHIT 33 Kontakt Chemie
Conductive coating; 200ml; Grey-black; Drying time: < 20min. (20°C); Aerosol;
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In stock:
52 pcs. |
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Packaging: 12 Quantity (multiple 1) |
0mg | 200ml | KONTAKT CHEMIE | Graphit 33 | Conductive coating | Aerosol | Can | ||||||||||||
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CH LAK-gr
Graphite varnish to repair tiles covered with graphite; 1,5ml; Also for creation or reconstruction of paths on low-current printed circuits;
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In stock:
31 pcs. |
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Packaging: 5 Quantity (multiple 1) |
0mg | 1,5ml | AG Termopasty | N/A | Graphite varnish | Paste | Tube | ||||||||||||
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CH PaTermCu1.5
Heat conductive paste based on copper; 1.5cm3; Thermal conductivity ~3.1W/m2; For filling the connections processor - radiator to improve cooling;
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In stock:
53 pcs. |
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Packaging: 5/65 Quantity (multiple 1) |
0mg | 1,5ml | AG Termopasty | Copper Thermal Grease | Thermal paste | Paste | Syringe | ||||||||||||
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CH Extreme-1
Heat conductive paste; 1g; Thermal conductivity 6W/m2; dielectric can be applied to various computer equipment components, LEDs, etc;
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In stock:
48 pcs. |
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Packaging: 5/40 Quantity (multiple 1) |
1g | 0ml | AG Termopasty | AG Extreme | Thermal paste | Paste | Syringe | ||||||||||||
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CH Extreme-3
Heat conductive paste; 3g; Thermal conductivity 6W/m2; dielectric can be applied to various computer equipment components, LEDs, etc;
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In stock:
10 pcs. |
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Packaging: 5/15 Quantity (multiple 1) |
3g | 0ml | AG Termopasty | AG Extreme | Thermal paste | Paste | Syringe | ||||||||||||
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CH Gold-1
Heat conductive paste based on gold; 1g; Thermal conductivity >2.8W/m2; Reduces the CPU temperature by about 6°, even without changing the radiator;
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In stock:
20 pcs. |
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Packaging: 5/20 Quantity (multiple 1) |
1g | 0ml | AG Termopasty | AG Gold | Thermal paste | Paste | Syringe | ||||||||||||
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CH Gold-3
Heat conductive paste based on gold; 3g; Thermal conductivity >2.8W/m2; Reduces the CPU temperature by about 6°, even without changing the radiator;
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In stock:
15 pcs. |
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Packaging: 5 Quantity (multiple 1) |
3g | 0ml | AG Termopasty | AG Gold | Thermal paste | Paste | Syringe | ||||||||||||
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CH Silver-0.5
Heat conductive paste based on Silver; 0.5g; Thermal conductivity >3.8W/m2; Tthermal conductivity much higher than typical carbon-silicon compounds;
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In stock:
103 pcs. |
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Packaging: 20 Quantity (multiple 1) |
0,5g | 0ml | AG Termopasty | AG Silver | Thermal paste | Paste | Foil | ||||||||||||
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CH Silver-1
Heat conductive paste based on Silver; 1g; Thermal conductivity >3.8W/m2; Tthermal conductivity much higher than typical carbon-silicon compounds;
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In stock:
45 pcs. |
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Packaging: 5 Quantity (multiple 1) |
1g | 0ml | AG Termopasty | AG Silver | Thermal paste | Paste | Syringe | ||||||||||||
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CH Silver-3
Heat conductive paste based on Silver; 3g; Thermal conductivity >3.8W/m2; Tthermal conductivity much higher than typical carbon-silicon compounds;
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In stock:
33 pcs. |
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Packaging: 5 Quantity (multiple 1) |
3g | 0ml | AG Termopasty | AG Silver | Thermal paste | Paste | Syringe | ||||||||||||
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CH Kl-term.10
Heat conductive AG Termo Glue; 10g; For mounting heat sinks on components such as the memory chips, transistors or bridge rectifiers; Work temperature up to 200°C;
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In stock:
10 pcs. |
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Packaging: 10 Quantity (multiple 1) |
10g | 0ml | AG Termopasty | AG TermoGlue | Thermally conductive adhesive | Paste | Syringe | ||||||||||||
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CH Kl-term.120
Heat conductive AG Termo Glue; 120g; For mounting heat sinks on components such as the memory chips, transistors or bridge rectifiers; Work temperature up to 200°C;
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In stock:
2 pcs. |
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Packaging: 2 Quantity (multiple 1) |
120g | 0ml | AG Termopasty | AG TermoGlue | Thermally conductive adhesive | Paste | Tube | ||||||||||||
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CH B327.250
Sodium persulfate for etching copper and PCB circuits etching, Fine-Crystaline; 250g; Bag;
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In stock:
1 pcs. |
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Packaging: 7 Quantity (multiple 1) |
250g | 0ml | AG Termopasty | Sodium Persulfate 99% | Copper etching | Powder | Ziplock bag | ||||||||||||
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In stock:
45 pcs. |
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Packaging: 15 Quantity (multiple 1) |
250g | 0ml | AG Termopasty | Sodium Persulfate 99% | Copper etching | Powder | Ziplock bag | ||||||||||||
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CH B327.500
Sodium persulfate for etching copper and PCB circuits etching, Fine-Crystaline; 500g; Bag;
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In stock:
53 pcs. |
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Packaging: 10 Quantity (multiple 1) |
500g | 0ml | AG Termopasty | Sodium Persulfate 99% | Copper etching | Powder | Ziplock bag | ||||||||||||
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ART.AGT-222 AG Termopasty
Double-component silicone filling compound 031; 100g; -55°C ~ 200°C; 980mg/cm3;
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In stock:
5 pcs. |
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Packaging: 4 Quantity (multiple 1) |
100g | 0ml | AG Termopasty | Silicone filling compound 031 | Silicone filling compound | Gel | Plastic container | ||||||||||||